For large semiconductor manufacturers, they have the core capability to manufacture this product line. Firstly, MEMS design and manufacturing capabilities, followed by ASIC design and manufacturing capabilities, and finally, high-capacity, low-cost packaging capabilities. So far, audio companies have dominated almost the entire MEMS microphone market, relying on semiconductor foundries to provide relevant technology and share profits with them. Now, Infineon's entry means that the market has new choices and reduces the risk for component buyers.
The limitations in size mainly come from the MEMS itself. In
addition, as the audio port cannot be operated using vacuum
tools, further reduction in size will be limited by standard
automated mounting tools during the manufacturing process.
More functions will be integrated into ASIC: digital output is
the first step; Standard components such as wind noise signal
filtering components can also be utilized; Specialized
interfaces and signal preprocessing will become significant
application areas; RF shielding will also be further improved.
In terms of audio, MEMS microphones also have many changes.
SMM310 is not only optimized for human voice in the frequency
range of 20Hz~20kHz, but also has high acoustic sensitivity.
It is difficult to predict when a single-chip camera phone with
an integrated microphone that can record wonderful stereo sound
will appear, but there is no doubt that technology is evolving
in this direction.
